CVE-2018-11277
mediumpriority · track · 31EPSS 0.002 · 6 %ileEUUSEPSS · scored 2026-10-27
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
cvss
Technical severity, 0–10. One row per scoring source.
base score 0–10 · higher = more severe · hover a vector to decode⚠ sources disagree · medium–high · 4.6–7.8
weaknesses
The CWE weakness classes this flaw belongs to.
affected products (21)
Products and version ranges known to be affected.
- Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear≤ MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660enisa_euvdEU
also known as (3)
Other names and identifiers for this entity.
sources
Which sources assert this record, and when.
references (3)
External citations — patches, advisories, analysis.
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