CVE-2018-11269
highpriority · track · 31EPSS 0.003 · 19 %ileEUUSEPSS · scored 2026-10-27
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options.
cvss
Technical severity, 0–10. One row per scoring source.
base score 0–10 · higher = more severe · hover a vector to decode
weaknesses
The CWE weakness classes this flaw belongs to.
affected products (36)
Products and version ranges known to be affected.
- Qualcomm, Inc. SSnapdragon Automobile, Snapdragon Mobile, Snapdragon Wear≤ MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016enisa_euvdEU
also known as (3)
Other names and identifiers for this entity.
sources
Which sources assert this record, and when.
references (5)
External citations — patches, advisories, analysis.
- https://www.qualcomm.com/company/product-security/bulletinscnnvd
- http://www.securityfocus.com/bid/105838enisa_euvd
- https://www.qualcomm.com/company/product-security/bulletinsenisa_euvd
- http://www.securityfocus.com/bid/105838Third Party AdvisoryVDB Entrynvd
- https://www.qualcomm.com/company/product-security/bulletinsVendor Advisorynvd
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