Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

productEU

A product tracked in the threat graph; the vulnerabilities below are known to affect it.

0
KEV-listed
0
EPSS ≥ 10%
by severity
2critical4high1medium0low
updated 2026-10-27
01

vulnerabilities (7)

Related CVEs.

IDseverity exploitable
CVE-2022-22057UShigh7.8Exploit
CVE-2022-25686UScritical9.8—
CVE-2022-25657UScritical9.8—
CVE-2020-11151USmedium6.4—
CVE-2022-25656UShigh7.8—
CVE-2022-22069UShigh7.8OT elevated—
CVE-2022-25696UShigh7.0—
02

weaknesses (7)

The flaw types (CWEs) most of these CVEs share.

  • CWE-120Buffer Copy without Checking Size of Input ('Classic Buffer Overflow')2 CVEs
  • CWE-362Concurrent Execution using Shared Resource with Improper Synchronization ('Race Condition')2 CVEs
  • CWE-416Use After Free2 CVEs
  • CWE-119Improper Restriction of Operations within the Bounds of a Memory Buffer1 CVEs
  • CWE-190Integer Overflow or Wraparound1 CVEs
  • CWE-312Cleartext Storage of Sensitive Information1 CVEs
  • CWE-367Time-of-check Time-of-use (TOCTOU) Race Condition1 CVEs
03

sources (1)

Which sources assert this record, and when.

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