Qualcomm Technologies Inc. SDM630
productRUA product tracked in the threat graph; the vulnerabilities below are known to affect it.
0
KEV-listed
0
EPSS ≥ 10%
by severity
3critical7high1medium0low
updated 2026-10-28
01
vulnerabilities (11)
Related CVEs.
| ID | severity | exploitable |
|---|---|---|
| CVE-2021-1931US | medium6.7 | Exploit |
| CVE-2019-10574US | high7.1 | — |
| CVE-2019-2287US | critical9.8 | — |
| CVE-2022-22091US | high7.5 | — |
| CVE-2022-25706US | high7.5 | — |
| CVE-2022-25690US | high7.5 | — |
| CVE-2022-25686US | critical9.8 | — |
| CVE-2022-25688US | critical9.8 | — |
| CVE-2018-11938US | high7.8 | — |
| CVE-2019-2321US | high7.8 | — |
| CVE-2022-22074US | high7.8 | — |
02
weaknesses (8)
The flaw types (CWEs) most of these CVEs share.
- CWE-120Buffer Copy without Checking Size of Input ('Classic Buffer Overflow')5 CVEs
- CWE-119Improper Restriction of Operations within the Bounds of a Memory Buffer4 CVEs
- CWE-125Out-of-bounds Read2 CVEs
- CWE-126Buffer Over-read1 CVEs
- CWE-129Improper Validation of Array Index1 CVEs
- CWE-190Integer Overflow or Wraparound1 CVEs
- CWE-285Improper Authorization1 CVEs
- CWE-680Integer Overflow to Buffer Overflow1 CVEs
03
sources (1)
Which sources assert this record, and when.
scry
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